Authors are requested to submit a camera-ready manuscript for proceeding no later than February 14th, 2014 by e-mail to email@example.com and ensure that the subject head of the e-mail has to be "Manuscript for the SSV Workshop proceeding."
Instruction for Authors
Please download a template file and follow the instruction described therein.
The SSV2014-YS will will present the Awards for Best Superconductor Chip to a student who has designed and/or fabricated the outstanding circuit and device, featuring such as highest performance, ultimately low-energy consumption, highest integration density, beautiful layouts, novel functionality, and ultrafine process, etc.
Candidates are required to submit the followings to the SSV2014-YS committee via e-mail at firstname.lastname@example.org.
- High-resolution image
- A 100-word appeal letter
Candidates must present their paper in oral or poster sessions. The deadline for the submissions is February 28, Friday 2014.